I have few questions about the Simufact material database for Inconel 718 powder, when looking into the flow curves all I could see is the data for the plastic region, I would like to know why the Simufact didn't consider the elastic region. Also in the mechanical properties what is the input for elastic modulus for this material because am not able to find it, did you consider infinite elastic modulus? if yes, could you please explain.
Kindly look in to the below plot I got from a simple compression test showing true stress and true strain for IN718 powder at 20C .
Could you please explain why the Simufact database doesn't have any elastic region data.
Thank you so much for letting know about the temp effect. I did turn off the effect and got the desired results. Since the real time experiment wont have the negligible temp effect I was worried if to turn it off so I let on.
I am trying to replace the rigid dies with deformable dies and assigned materials and other properties, but my simulation is not running could you please let me know what wrong I could be doing?
One big main difference between rigid and deformable dies is, that rigid dies have a movement defined (not moving, press driven, spring controlled, free movement along a defined direction, ...) while deformable dies do not have this. Deformable dies always need some constrains to define which surface of them is not moving or moving as defined by the constrain.
There are several possible constrains. I prefer to use rigid dies as constrains. Please take care to fill the contact table completely to define all needed contacts between workpiece and dies and between dies and dies.
I hope this helps, if not I need a look at the model.
I would like you to take a look in to the model which I have sent you before and please confirm why am I getting high temperatures in the workpiece when I replace my dies with Rigid with heat conduction instead of with out heat conduction. since I replace my dies with heat conduction the temp in the workpiece should be less compared to the model with dies without heat conduction right. May I know if there is any mistake in the model with respect to heat transfer parameters.
please do not mix "heat conduction" with "heat transfer". Both, rigid dies and rigid dies with heat conduction, have heat transfer from the workpiece to the die. But for rigid dies, the die surface temperature remains constant. Where as rigid dies with heat conduction and deformable dies heat up locally and develop a temperature distribution inside and at the surface based on their heat conduction and heat capacity .
The heat transfer is defined as power (W) per area (m²) and temperature difference (K or °C). When the rigid dies with heat conduction heat up locally, the temperature difference gets smaller. Thus the heat transfer decreases and the temperature of the workpiece increases.
The rigid dies with out heat conduction, but with heat transfer, remain "cold", the temperature difference high, thus the heat transfer high and thus the workpiece temperature low.
In this regard deformable dies behave like rigid dies with heat conduction.
If you change the die types, you may have to adjust your heat transfer coefficients.
Is Simufact using any temperature correction model? If yes, May I know what kind of temperature model are you using for temperature correction in the simulations.
sorry for my late reply, I was out of the office for a few days hoping that the community picks up open questions.
What do you mean with "temperature correction model"?
If temperature effects are enabled (this is the default, see Forming Control / Miscellaneous), we convert 90% of the energy needed for plastic deformation into heat. And 90% of the energy needed for friction into heat.
The first can be set as Dissipation Factor in the thermal properties of the workpiece, the later can be set in the Forming Controll in the friction section.
I was actually performing a temperature correction for my results since the obtained stresses are not at nominal temperatures but are sum of Delta T and T.