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I would like to know how to make a thermal connection between two objects in a Patran/Nastran 2021 heat transfer analysis.

Ruku2357
I did a thermal analysis on two blocks with temperatures on the top and bottom.
There was no heat transfer between the two blocks, and the temperatures were constant for each block.
 
I would like to know how to thermally connect the blocks.
 
I am a beginner just starting out, so I would appreciate as much detail as possible. 
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    Capture1
    Yes, you can use thermal glue contact if the nodes are not coincident. In PATRAN you can create contact bodies and body pairs automatically using tools-Modeling- contact bodies pairs. (see slide 2) of the attached powerpoint, and you can set the contact detection (ERROR)=0.1, which is the the distance separated by 2 contact bodies, and you can activate HGLUE=1 for thermal glue contact.(see slide 3 and 4)
    I am including the PATRAN DB 2021 in the zip file, and also the NASTRAN SOL 400 test deck.
     
    In addition you can use Near Thermal contact (DQNEAR=0.1) to use thermal contact coefficient instead of glue thermal contact. The differences between the glue thermal contact and near thermal contact is that there is no thermal resistance between contact body 1 and 2 with glue thermal contact, whereas the DQNEAR option you can specify thermal contact coefficient (thermal resistance) between 2 parts such as thermal grease or adhesive between 2 parts.
    Capture
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  • 0
    Capture1
    Yes, you can use thermal glue contact if the nodes are not coincident. In PATRAN you can create contact bodies and body pairs automatically using tools-Modeling- contact bodies pairs. (see slide 2) of the attached powerpoint, and you can set the contact detection (ERROR)=0.1, which is the the distance separated by 2 contact bodies, and you can activate HGLUE=1 for thermal glue contact.(see slide 3 and 4)
    I am including the PATRAN DB 2021 in the zip file, and also the NASTRAN SOL 400 test deck.
     
    In addition you can use Near Thermal contact (DQNEAR=0.1) to use thermal contact coefficient instead of glue thermal contact. The differences between the glue thermal contact and near thermal contact is that there is no thermal resistance between contact body 1 and 2 with glue thermal contact, whereas the DQNEAR option you can specify thermal contact coefficient (thermal resistance) between 2 parts such as thermal grease or adhesive between 2 parts.
    Capture
    Attached Files (1)
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